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HTRM
HTRM
hang Tags
Polyimide film
Applications
13,5
μm
25
μm
30
μm
40
μm
50
μm
75
μm
80 μm
100
μm
125
μm
180
μm
PI adhesive tape
Germetic-260
Compound V-91
Heat Resistant Enamel
Varnishes
About us
Contacts details
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Table of
properties
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No.
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Items
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Specification
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Analysis result
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1
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Appearance
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The surface of the film shall be smooth and free
from bubbles, holes, contaminations and other defects, cutting edge tidy,
not damaged.
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Pass
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2
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Thickness Nominal, μm
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50+18%
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50.1+1.8/-1.6
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3
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Density, kg/m3
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1420+20
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1430
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4
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Tensile Strength,
Mpa(kgf/cm2) ≥
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MD ≥140
TD ≥140
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MD:182
TD :180
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5
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Elongation at Rupture, % ≥
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MD ≥40
TD ≥40
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MD:113
TD :114
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6
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Shrinkage, (%)
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MD ≤0.1(200ºC/392F
2HRS)
TD ≤0.1(200ºC/392F
2HRS)
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MD≤0.1
TD≤ 0.1
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7
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Dielectric Strength, MV/m ≥
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Average Value ≥150
Typical Value ≥100
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Average Value:307
Typical Value:265
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8
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Surface Resistivity, Ω ≥
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20ºC/68F+5≥1.0×1013
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3.6*1016
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9
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Volume Resistivity, Ω.cm ≥
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20ºC/68F+5≥1.0×1015
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4.7*1013
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10
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Dielectric Constant, (106H)
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48-62HZ≤3.9
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2.9
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11
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Dielectric Tangent, (106H)≤
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48-62HZ≤5.0*10-3
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2.5*10-3
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12
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Dyne
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≥45
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≥50
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