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HTRM
HTRM
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Polyimide film
Applications
13,5
μm
25
μm
30
μm
40
μm
50
μm
75
μm
80 μm
100
μm
125
μm
180
μm
PI adhesive tape
Germetic-260
Compound V-91
Heat Resistant Enamel
Varnishes
About us
Contacts details
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Table of
properties
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No.
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Items
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Specification
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Analysis result
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1
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Appearance
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The surface of the film shall be smooth and free
from bubbles, holes, contaminations and other defects, cutting
edge tidy, not damaged.
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Pass
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2
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Thickness Nominal, μm
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25+14%
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25.6+1.3/-1.3
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3
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Density, kg/m3
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1420+20
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1426
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4
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Tensile Strength,
Mpa(kgf/cm2) ≥
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MD ≥140
TD ≥140
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MD:190
TD :191
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5
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Elongation at Rupture, % ≥
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MD ≥40
TD ≥40
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MD:113
TD :110
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6
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Shrinkage, (%)
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MD ≤0.1(200ºC/392F 2HRS)
TD ≤0.1(200ºC/392F 2HRS)
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MD≤:0.09
TD≤ 0.1
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7
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Dielectric Strength, MV/m ≥
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Average Value ≥150
Typical Value ≥100
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Average Value:288
Typical Value:258
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8
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Surface Resistivity, Ω ≥
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20ºC/68F+5≥1.0×1013
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1.0*1016
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9
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Volume Resistivity, Ω.cm ≥
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20ºC/68F+5≥1.0×1015
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4.7*1013
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10
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Dielectric Constant, (106H)
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48-62HZ≤3.9
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2.3
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11
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Dielectric Tangent, (106H)≤
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48-62HZ≤5.0*10-3
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1.7*10-3
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12
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Dyne
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≥45
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≥50
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