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Polyimide film
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13,5
μm
25
μm
30
μm
40
μm
50
μm
75
μm
80 μm
100
μm
125
μm
180
μm
PI adhesive tape
Germetic-260
Compound V-91
Heat Resistant Enamel
Varnishes
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Table of properties
No.
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Items
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Specification
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Analysis result
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1
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Appearance
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The
surface of the film shall be smooth and free from bubbles, holes, contaminations
and other defects, cutting edge tidy, not damaged.
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Pass
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2
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Thickness Nominal, (μm) |
13+18% |
13+0.6/-0.5
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3
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Density, (kg/m3) |
1420+20
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1429
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4
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Tensile Strength
,
Mpa (kgf/cm2) ≥
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MD ≥140
TD ≥140
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MD:164
TD:163
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5 |
Elongation at Rupture, % ≥
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MD ≥40
TD ≥40
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MD:58
TD:56
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6 |
Shrinkage, (%) |
MD ≤0.1(200ºC/392F 2HRS)
TD ≤0.1(200ºC/392F 2HRS) |
MD≤0.1
TD≤0.1
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6 |
Dielectric Strength, MV/m ≥
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Average Value ≥150
Typical Value ≥100
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Average Value:353
Typical Value:258
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7 |
Surface Resistivity, Ω ≥
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20ºC/68F+5≥1.0×1013
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1.0*1016
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7 |
Volume Resistivity, Ω.cm ≥
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20ºC/68F+5≥1.0×1015
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6.7*1013
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8 |
Dielectric Constant, (106H) |
48-62HZ≤3.9
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2.2
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1
0 |
Dielectric Tangent, (106H)≤
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48-62HZ≤5.0*10-3
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1.7*10-3
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1
1 |
Dyne
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≥45
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≥50
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