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Polyimide film
Applications
13,5
μm
25
μm
30
μm
40
μm
50
μm
75
μm
80 μm
100
μm
125
μm
180
μm
PI adhesive tape
Germetic-260
Compound V-91
Heat Resistant Enamel
Varnishes
About us
Contacts details
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About
polyimide films:
Polyimide
film is achieved by polycondensation of PMDA and ODA in strong polar
solvents and through the process of forming film and imine treatment at
high temperature, which possesses excellent physical, chemical, and electrical
properties, atomic radiation resistant, solvent resistant, low &
high
temperature resistant. The polyimide Film is a common polyimide
film condensed with 4-formic acid-2-anhydride of benzene, and
4.4-diamino-biphenyl-ether oxide. It performs successfully in the wide range of
temperatures as low as
-269ºC/-452F
and as high as
260ºC/500F.
Because
of
its unique excellent properties, it is the most ideal choice in many applications.
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Property
Name
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General
Table of properties
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Appearance
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Transparent
or semi-transparent golden film with smooth and flat surface and
without any needle cavities, bubbles or electrically conductive
impurities.
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Thickness
Nominal, (μm）
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13.0
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25.0
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30.0
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40.0
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50.0
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75.0
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100.0
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125.0
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150.0
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175.0
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Thickness
Tolerance, (μm)
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±2.2
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±3.0
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±3.0
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±4.0
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±5.0
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±7.5
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±10
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±12.5
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±15.0
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±17.5
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Width, (mm）
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6-1000
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Length,
(m) ≥
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200
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Tensile
Strength,
Mpa (kgf/cm2)
≥
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135（1350）
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Elongation,
at Rupture
％≥
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40
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60
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Dielectric
Strength, MV/m ≥
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180
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160
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120
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Surface
Resistivity,
Ω ≥
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1.0×1013
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Volume
Resistivity, Ω.cm ≥
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1.0×1015
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Dielectric
Constant,（106H）
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3-4
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Dielectric
Tangent,（106H）≤
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1.0-10-3
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